Method for producing a vertical field effect transistor

ABSTRACT

A method for producing a field effect transistor, in which a plurality of layers are in each case deposited, planarized and etched back, in particular a gate electrode layer, is disclosed. This method allows the manufacturing of transistors having outstanding electrical properties and having outstanding reproducibility.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of international applicationPCT/EP2004/052485, filed Oct. 8, 2004, which claims priority to Germanpatent application serial number DE 10350751.5, filed Oct. 30, 2003.

BACKGROUND

1. Field of the Invention

The invention relates to a method for producing a vertical field effecttransistor.

2. Description of the Related Art

The field effect principle consists in influencing the current flow in achannel by means of the potential at a control electrode. The controlelectrode is also referred to as the gate. The field effect transistorsfor logic circuits are intended to have a short gate length, a thin gatedielectric and, at the same time, a large switch-on current. Moreover,the operating voltage is intended to be as small as possible in order toavoid excessively large leakage currents through the thin gatedielectric. Conventional planar field effect transistors cannot meetthese requirements.

For example, the German patent specification DE 199 24 571 C2 disclosesa double gate structure that enables a high switch-on current becausetwo gates contribute to the current control. The operating voltage canbe reduced for this reason. Dual or even triple gate structures are apromising approach for improving the electrical properties of a fieldeffect transistor, particularly at ultrashort gate lengths, that is tosay gate lengths of less than 100 nanometers.

However, multiple gate structures have drawbacks. For example multiplegate structures are three-dimensional structures, so that theirproduction is difficult and must be carefully optimized. Despite thesmall dimensions, the area requirement of chip area per transistor isalso still intended to be as small as possible. Moreover, thetransistors are intended to have electrical properties like silicon oninsulator (SOI) wafers.

Accordingly, there exists a need for a field effect transistor thatavoids excessively large leakage currents through the thin gatedielectric in a small package.

SUMMARY

The invention provides a simple method for producing a field effecttransistor having very good electrical properties. Moreover, theintention is to specify a field effect transistor having very goodelectrical properties that is simple to produce, in particular a FLASHmemory transistor.

In another embodiment of the invention, the additional steps ofplanarization of the control electrode layer, and whole-areaetching-back of the planarized control electrode layer are performed.

The above steps are simple to perform and have the consequence that thecontrol electrode can be produced in particular with a rectangular orsquare cross section. In particular, the width of the control electroderemains the same with increasing distance from the substrate. Taperingsections can be avoided at the control electrode. The control electrodecan therefore be produced in a very dimensionally accurate manner andwith high positioning accuracy with regard to the projection. Therefore,field effect transistors are produced with mutually identical andparticularly good electrical properties.

The whole-area etching-back is preferably carried out anisotropically.Given a suitable choice of materials, however, it is also possible foran isotropic etching-back step to be performed.

The production method according to the invention is used in particularin the production of so-called vertical transistors, which have only asmall area requirement.

In yet another embodiment, the gate electrode remains along a completecirculation around the projection after the conclusion of the whole-areaetching-back. The layout of a FinFET is thus rotated through 90 degrees,so that the fin lies vertically with respect to a wafer surface. If thefin has a square or rectangular cross section parallel to the surface ofthe chip or wafer, then four control electrodes protrude from the foursidewalls of the gate. The control electrodes enclosing the projectionlead to a particularly high switch-on current. Given a minimaldimensioning of the projection e.g. with a side length of less than 50nanometers, during operation of the field effect transistor a substrateregion depleted of charge carriers arises as in the case of an SOIsubstrate, but without an expensive SOI substrate being required.

The height of the projection is to be dimensioned such that the thinnestpossible gate electrode and the adjacent spacer layers for insulatingthe gate electrode located toward the source and drain, stacked oneabove another, are smaller than the height of the projection. Space fora connection electrode, in particular for the source contact, may alsodetermine the height.

In another embodiment, a part of the structure or a part of aninsulating layer covering the structure is uncovered during theetching-back of the planarized control electrode layer, so that thispart is accessible for further processing steps and for the arrangementof further elements.

In another development, prior to the application of the controlelectrode layer, the spacer layer near to the substrate is planarizedand etched back over the whole area, preferably a part of the structurebeing uncovered. As an alternative the spacer layer near to thesubstrate can also be applied such that it is only very thin, with theresult that etching-back is not necessary. However, etching-back leadsto a very dimensionally accurate spacer layer.

In a another embodiment, after the etching-back of the control electrodelayer, an electrically insulating spacer layer remote from the substrateis applied, planarized and etched back over the whole area. Inparticular the repeated planarization and etching-back in the case ofsuccessively applied layers make it possible to achieve a dimensionallyaccurate three-dimensional integration.

In yet another embodiment, the thickness of the lower spacer layer isnot equal to the thickness of the upper spacer layer. This hasadvantages in the optimization of the transistors. Different thicknessesare not simple to realize in a normal CMOS flow.

In another embodiment, after the application of the spacer layer remotefrom the substrate, a connection electrode layer is applied, preferablya source layer. The source layer preferably covers the sidewalls of theprojection, so that the contact area is enlarged. In one refinement, theconnection electrode layer is additionally planarized, so that it cansubsequently be patterned without any problems.

In yet another embodiment of the method according to the invention, thespacer layer near to the substrate, the control electrode layer and thespacer layer remote from the substrate and also the connection electrodelayer are patterned jointly, e.g. by means of a photolithographic methodor by means of a spacer technique. The number of production steps arefew in number as a result.

In another embodiment, an electrically insulating layer is applied asgate dielectric on a part of the structure after the etching-back of thespacer layer near to the substrate and prior to the application of thecontrol electrode layer, in particular by a whole-area layer deposition,for example of a material having a relative permittivity of greater than4 or greater than 8, or by thermal growth, for example a thermaloxidation.

In yet another embodiment, the structure is formed with the aid of ahard mask, the hard mask being used as a stop layer during all theplanarization steps mentioned. It is thus possible to stop veryaccurately at a predetermined level. Proceeding from this level, it isthen possible to perform a time-controlled etching-back process duringwhich it is possible to produce an etched-back layer having a layerthickness in a small tolerance range.

In another embodiment, a charge storage layer is applied after theapplication of the spacer layer near to the substrate and prior to theapplication of the control electrode layer. The charge storage layer ispatterned prior to the application of the control electrode layer. Thecharge storage layer is electrically conductive, e.g. metallic,semiconducting or electrically insulating. In the case of anelectrically insulating charge storage layer, the charges are introducedin particular with the aid of tunneling currents. The development givesrise to e.g. an EEPROM (Electrically Erasable Programmable Read OnlyMemory) cell, which can be erased independently of adjacent cells, or aflash EPROM cell, which can only be erased jointly with adjacent cells.

In another embodiment, “buried” bit lines produced by substrate dopingsare used in the memory unit. The memory unit is organized e.g. as a NORtype or as an SNOR. Tunneling currents, in particular Fowler-Nordheimtunneling currents (FN), are used for erasure. Tunneling currents or hotcharge carriers (CHE—Channel Hot Electron) are used for programming. Thedimensionally accurate fabrication on account of the single or multipleplanarization and etching-back leads to outstanding electricalproperties of the memory cell, in particular with regard to theprogramming reliability, the number of programming cycles and withregard to the shift in the threshold voltage.

In another embodiment, the charge storage layer is planarized andsubsequently etched back over the whole area, preferably a part of thestructure or a part of the insulating layer being uncovered. By means ofthese steps, it is possible to produce a charge storage layer with a toparea that lies parallel to a substrate layer or to the base area. Such acharge storage layer leads to defined programming and erasureoperations. In one development, at least one spacer element is formed onthe structure and on the charge storage layer. The spacer element thenserves for the patterning of the charge storage layer, so that a simpleself-aligning spacer technique is used for patterning.

The invention additionally relates to a vertical field effect transistorwhose control electrode has a planar interface remote from thesubstrate, said interface lying parallel to a base area of theprojection that is near to the substrate. In one embodiment, the controlelectrode is delimited by the planar interface everywhere in thedirection of the normal to the base area, which points away from thesubstrate. Expressed in different words, “upwardly” there are noinclined interfaces or upwardly tapering projections which would makethe electrical properties of the transistor less controllable.

In another embodiment, the field effect transistor has at least onecharge storage region arranged between an insulating region and acontrol electrode region, having a planar interface remote from thesubstrate, said interface lying parallel to the base area of theprojection. This gives rise to a memory transistor having defined andwell-controllable electrical properties. In one embodiment, the fieldeffect transistor is formed as a sidewall transistor or as a so-calledsurrounded gate transistor.

In particular, the field effect transistors have been produced by themethod according to the invention or one of its developments, so thatthe technical effects mentioned above are applicable.

Further objects, features and advantages of this invention will becomereadily apparent to persons skilled in the art after a review of thefollowing description, with reference to the drawings and claims thatare appended to and form a part of this specification.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a simplified illustration of a sidewall field effecttransistor;

FIG. 2 shows a plan view of the field effect transistor;

FIGS. 3A and 3B show production stages in the production of the fieldeffect transistor;

FIG. 4 shows an alternative production stage in the production of thefield effect transistor; and

FIGS. 5A and 5B show production stages in the production of a sidewallflash field effect transistor.

DETAILED DESCRIPTION

FIG. 1 shows a vertical fin field effect transistor 10 formed on a fin12. The fin 12 has been etched from a semiconductor substrate 13, whichhas a planar substrate surface 14 after etching. By way of example, asilicon substrate which is initially predoped or undoped is used. Thefin 12 may have a height H of 100 nanometers in the direction of thenormal N to the substrate surface 14. The width B of the fin 12 is e.g.20 nanometers. The length L of the fin 12 is e.g. 60 nanometers.

At the foot F of the fin 12 or at the base of the fin 12, a base area ofthe fin 12 is situated in the plane of the substrate surface 14. A gateelectrode 16 encloses the fin 12 and lies parallel to and at a distancefrom the substrate surface 14. The distance may be 30 nanometers. Thegate electrode 16 comprises doped polycrystalline silicon.

A gate dielectric 18 (not illustrated in FIG. 1) is situated between thegate electrode 16 and the fin 12. Suitable gate dielectrics are silicondioxide or insulating materials having a relative permittivity ofgreater than 3.9 or greater than 7, such as high-k materials.

A drain region 20 is arranged in the upper part of the fin 12. The drainregion is n-doped in the case of an n-channel transistor and p-doped inthe case of a p-channel transistor. Around the base area at the foot Fof the fin 12, a source region 22 is arranged in the substrate 13directly beneath or adjoining the substrate surface 14. The sourceregion having the same doping as the drain region 20. In anotherexemplary embodiment, the source region is arranged in the fin 12 andthe drain region is arranged in the substrate. In another exemplaryembodiment, the doping of the source and the doping of the drain aredifferent in order to permit good optimization of the transistors. Theheight H of the fin 12 is determined by the height of two spacerelements for insulating the gate electrode 16 from the substrate surface14 and from a drain connection, respectively, by the height H2 of thegate electrode and by the height of a drain connection.

FIG. 2 shows a plan view of the field effect transistor 10 with an areaS for the source region 22 or for a source connection region, with anarea G for the gate electrode or for a gate electrode connection region,and with an area D for the drain region or for a drain connectionregion. The connection regions are square or rectangular and lie ondifferent sides of the fin 12. The drain connection region D alsoencloses the fin 12. The field effect transistor 10 is thus a verticalfield effect transistor having four control electrodes or gate regionsand having a small structural height.

FIG. 3A shows a production stage in the production of the field effecttransistor 10. Proceeding from the substrate 13, shallow isolationtrenches (not illustrated) are produced, which serve for isolatingtransistors from each one another. The isolation trenches are filled ina known manner with an insulating material, such as silicon dioxide.After filling, planarization is effected, e.g. by means of a chemicalmechanical polishing method CMP.

After planarization, a hard mask layer 50, such as, a silicon nitridelayer is deposited. The hard mask layer 50 is patterned with the aid ofa photolithographic method or with the aid of a spacer technique. A hardmask 52 remaining in the region of the transistor 10. Further hard masksections remain at other locations of the substrate 13 for the purposeof producing a multiplicity of other transistors. The transistors areproduced by means of the same method steps described and are thereforeconstructed identically. The hard mask 52 has, for example, theabovementioned dimensions of 20 nanometers by 60 nanometers.

After the patterning of the hard mask layer 50, the substrate 13 ispatterned in accordance with the hard mask by means of the same etchingmethod previously described, producing the fin in the process. Etchingis effected in a time-controlled manner by means of a known etchingmethod. If appropriate, the hard mask layer is also thinned duringetching. After the production of the fin, the hard mask layer 50 mayhave a thickness of 40 nanometers.

A thin screen oxide layer 54 is subsequently produced in order toprotect the substrate during the source implantation steps that follow.The oxide layer 54 is produced by means of a thermal oxidation with athickness that may be less than 10 nanometers. Afterward, using a low tomedium acceleration voltage, the source region 22 or S is highly dopedwith the aid of an implantation.

The implantation is followed by the deposition of an electricallyinsulating spacer layer 56 having a thickness which is higher than theheight H of the fin 12 plus the thickness of the hard mask 52. By way ofexample, the spacer layer 56 is a silicon dioxide layer having anoriginal thickness of 140 nanometers. The spacer layer 56 is planarized,with the aid of a chemical mechanical polishing method, stopping on thehard mask 52 or on the residues of the hard mask layer 50 at CMPauxiliary structures (not shown).

After the planarization, the spacer layer 56 is etched back over thewhole area to its target thickness, for example to 30 nanometers or to athickness in the range of 30 nanometers to 50 nanometers. The etch iscarried out in a time-controlled manner.

In the etched-back region, by means of an additional isotropic oxideetch in the exemplary embodiment, the thin screen oxide layer 54 is alsoremoved from the vertical sidewalls of the etched structure. The sideareas of the fin 12 are thus uncovered again.

A gate dielectric layer 58 is then deposited, by sputtering or vaporphase deposition CVD (Chemical Vapor Deposition). The gate dielectriclayer 58 comprises oxynitride or some other high-k material. Theoxide-equivalent thickness of the gate dielectric layer 58 is 1nanometer in the exemplary embodiment. As an alternative, the thicknessof the gate dielectric layer 58 lies in the range of 1 nanometer to 2nanometers.

As is furthermore shown in FIG. 3A, a gate electrode layer 60 issubsequently applied, in particular deposited. The gate electrode layer60 comprises a metal or highly doped polycrystalline silicon. At the endof application, the gate electrode layer 60 has a thickness that isgreater than the distance in the direction of the normal N from thesurface—remote from the substrate—of those regions of the gatedielectric layer 58 which do not lie on the hard mask 52 as far as thesurface of the hard mask 52 that is removed from the substrate. A cutoutbetween adjacent fins 12, including hard masks 52, are thus completelyfilled with the material of the gate electrode layer 58. In theexemplary embodiment, the gate electrode layer 60 is applied with athickness of 110 nanometers.

After the application of the gate electrode layer 60, planarization isagain effected, with the aid of a CMP method, stopping on the hard mask52 or the part of the electrode layer which bears on the hard mask 52.

As shown in FIG. 3A, the planarized gate electrode layer 60 is thenetched back over the whole area, in particular using an anisotropicetching method. Over the whole area means, in this case, that no mask isused for the patterning of the gate electrode layer 60 during theetching-back step. The time duration for the etching-back determines theremaining thickness of the gate electrode layer 60. In the exemplaryembodiment, the gate electrode layer 60 has a remaining thickness of 20nanometers after the etching-back. On account of the planarizationpreceding the etching-back, the etched-back gate electrode layer 60 hasa uniform layer thickness. The gate electrode layer 60 is thus etchedback to below the surface of the hard mask 52 that is remote from thesubstrate and also below the surface of the fin 12 that is remote fromthe substrate.

After the etching-back or else prior to the etching-back of the gateelectrode layer 60, the gate electrode layer 60 and preferably also thespacer layer 56 may already be patterned by means of a lithographicmethod or by means of a spacer technique, in other words using a mask.As an alternative, however, the patterning of the gate electrode layer60 and, if appropriate, also of the spacer layer 56 is carried out at alater point in time jointly with at least one layer applied after theapplication of the gate electrode layer 60. The gate electrodeconnection layer 16 arises during the patterning of the gate electrodelayer 60.

As is furthermore shown in FIG. 3A, after the etching-back of the gateelectrode layer 58, a second electrically insulating spacer layer 62 isapplied, by means of a deposition. In the exemplary embodiment, thesecond spacer layer 62 comprises the same material as the spacer layer56 that is nearer to the substrate 13. As an alternative, however, thespacer layers 56 and 62 comprise mutually different materials.

The spacer layer 62 is applied with a thickness that is greater than thedifference in height between the substrate-remote surface of the hardmask 52 or the substrate-remote surface of the gate dielectric layer 58that has remained on the hard mask and the substrate-remote surface ofthe etched-back gate electrode layer 60. In the exemplary embodiment,the thickness of the spacer layer is 90 nanometers directly afterapplication.

The spacer layer 62 is subsequently etched back over the whole area to atarget thickness of e.g. 30 nanometers, so that the surface of thespacer layer 62 that is remote from the substrate and lies approximately10 nanometers below the free end of the fin 12.

In a further method step, as illustrated in FIG. 3B, the uncovered gatedielectric 58 is removed, dry-chemically or wet-chemically, from theareas of the fin 12 that have not yet been covered and from the hardmask 52. A connection region for making contact with the drain region isthus uncovered at the free end of the fin 12. Optionally, the residualhard mask 52 is also removed wet-chemically.

A drain contact material 64 is subsequently deposited, preferably with athickness that is greater than the residual difference in height bywhich the fin 12 or by which the hard mask 52 projects above the spacerlayer 62. The drain contact material 64 is highly doped polycrystallinesilicon. Optionally, the drain contact material 64 is then planarizedand etched back over the whole area.

The drain contact material 64 is subsequently patterned by means of alithography method. Steps for producing metal contacts optionallyfollow. During the deposition of the drain contact material 64 or duringsubsequent thermal steps, dopant diffuses from the drain layer 64 intothe fin 12 in order to form the drain zone. At the same time, dopantdiffuses from the source region into the lower region of the fin inorder to form the source connection to the channel. The drain region 20arises from the drain contact material 64 during patterning.

FIG. 4 shows an alternative production stage in the production of thefield effect transistor 10. Instead of the deposition of a gatedielectric layer 58, after the spacer layer 56 has been etched back, agate dielectric 70 is only applied on the uncovered sidewalls of the fin12, in particular by means of a thermal oxidation. As an alternative, anoxynitride layer is only produced on the sidewalls of the fin 12. Thesame production steps as have been explained with reference to FIGS. 3Aand 3B are then performed.

FIGS. 5A and 5B show production stages in the production of a verticalsidewall flash field effect transistor 100. The production of thetransistor 100 proceeds as in the production of the transistor 10 or thealternatives mentioned e.g. apart from the additional method steps forproducing a charge storage layer or a so-called floating gate which areexplained below.

In particular, the following method steps are again performed in theorder mentioned below. Proceeding from a substrate 113, a fin 112 havingthe same dimensions as the fin 12 is produced by means of a hard mask152 or by means of some other technique. Next, a thin screen oxide layer154 is applied. Afterwards, source regions 122 are implanted. Therefore,an electrically insulating planar spacer layer 156 is producedpreferably by deposition, planarization and whole-area etching-back.Finally, a first gate dielectric layer 158 is produced by whole-areadeposition like the gate dielectric layer 58. As an alternative, a gatedielectric corresponding to the gate dielectric 70 is produced only onthe fin 112.

As shown in FIG. 5A, steps for producing a charge storage region 159 arecarried out after the production of the first gate dielectric. For thispurpose, a highly doped polycrystalline silicon layer is deposited. Asan alternative, a dielectric material or a metal may also serve asmaterial for the charge storage region. The layer for producing thecharge storage region 159 is deposited with a thickness which enablessubsequent complete planarization. By way of example, the layerthickness is 110 nanometers after application.

The material for producing the charge storage region 159 is subsequentlyplanarized, by means of CMP, CMP stop structures preferably serving as astop. This is followed by whole-area etching-back, the remainingthickness of the layer for forming the charge storage region 159 being30 nanometers remaining.

As is furthermore shown in FIG. 5A, a spacer element 161 or a spacer issubsequently produced by means of a layer deposition and anisotropicetching, which spacer element or spacer, on the sidewalls covered withthe gate dielectric, encloses the fin 112 and, if appropriate, thesidewalls of the hard mask 152 that are covered with gate dielectric.The spacer element 161 bears on the layer for forming the charge storageregion.

The layer for forming the charge storage region 159 is subsequentlypatterned with the aid of the spacer element 161 as a hard mask in ananisotropic etching process. The spacer element 161 is then removed. Thehard mask 152 still remains on the fin 112 in the exemplary embodiment.

As is shown in FIG. 5B, a further dielectric layer 163 is then produced.The same method steps as for producing the transistor 10 aresubsequently carried out as described below.

First, production of an electrically conductive gate electrode layer160, made of highly doped polycrystalline silicon, by deposition,planarization and whole-area etching-back is executed. The thickness andthe material of the gate electrode layer 160 are the same as thethickness and the material of the gate electrode layer 60. In theexemplary embodiment, the gate electrode layer 160 has been etched backfurther than the charge storage region 159. As an alternative, however,the gate electrode layer 160 is etched back to a lesser extent, so thatit overlaps the charge storage region 159.

Production of a further electrically insulating spacer layer 162, whichis or may be the same as the spacer layer 62 in terms of its thicknessand in terms of its material. However, it is also possible to use othermaterials or some other thickness of the spacer layer. Afterwards, thegate electrode layer 160 and of the spacer layer 162 is patterned bymeans of a photolithographic method. Next, the two gate dielectricsabove the spacer layer 162, are eliminated and then the residual hardmask 152 may be optionally removed. Therefore, application of draincontact material 164, which corresponds to the drain contact material64, preferably by deposition, planarization and whole-area etching-back,as a result of which the drain-gate capacitance decreases is executed.Finally, the drain contact material 164 is patterned.

The flash cell is preferably programmed by means of “hot” chargecarriers, which are also referred to as CHE or channel hot electrons.Fowler-Nordheim tunneling currents are preferably used for erasure. Theflash cells are organized in accordance with the known NOR structure.This means that the source connections are patterned as bit lines in abit line direction. Word lines produced by patterning of the gateelectrodes run at right angles to the bit lines. A multiplicity ofmemory transistors of a memory cell array constructed in matrix-typefashion are situated on each bit line and word line, respectively.

In other exemplary embodiments, no hard mask 52, 152 is used, or thehard mask 52, 152 is removed early, so that the end of the fin 12 or 112serves as a reference point for the thickness of the layers to beplanarized.

By account of the buried source regions 122, the transistor 100 requiresonly a small substrate area. Moreover, the four gate regions enable alarge switch-on current, so that a reduced operating voltage of e.g.less than 3 volts can be utilized. The production methods specified aresimple and enable transistors to be produced reproducibly within verynarrow tolerances.

As a person skilled in the art will readily appreciate, the abovedescription is meant as an illustration of implementation of theprinciples this invention. This description is not intended to limit thescope or application of this invention in that the invention issusceptible to modification, variation and change, without departingfrom spirit of this invention, as defined in the following claims.

1. A method for producing a vertical field effect transistor comprisingthe following steps: forming of at least one structure on a substratewhich serves for forming the channel region of a field effecttransistor; applying an electrically insulating spacer layer near to thesubstrate after the formation of the structure; applying an electricallyconductive or semiconducting control electrode layer which serves forforming the control electrode of the field effect transistorplanarization of the control electrode layer; and whole-areaetching-back of the planarized control electrode layer.
 2. The method ofclaim 1, further comprising uncovering during the etching-back of theplanarized control electrode layer a part of the structure or a part ofan insulating layer covering the structure.
 3. The method as claimed inclaim 1, further comprising, prior to applying the control layerelectrode, the steps of: planarizing the spacer layer near to thesubstrate; and whole-area etching-back of the spacer layer near to thesubstrate.
 4. The method of claim 1 further comprising: applying anelectrically insulating spacer layer remote from the substrate after theetching-back of the control electrode layer; planarizing the spacerlayer remote from the substrate; and whole-area etching-back of thespacer layer remote from the substrate.
 5. The method of claim 4,further comprising, after the application of the spacer layer remotefrom the substrate, the steps of: applying a connection electrode layerserving for forming a connection electrode of the field effecttransistor; and planarizing the connection electrode layer.
 6. Themethod of claim 5, further comprising joint patterning of the controlelectrode layer and of the spacer layer remote from the substrate. 7.The method of claim 1, further comprising forming an electricallyinsulating layer on a part of the structure near the substrate after theetching-back of the spacer layer and prior to the application of thecontrol electrode layer.
 8. The method of claim 7, wherein theelectrically insulating layer is produced by whole-area layer depositionor by thermal growth.
 9. The method of claim 1, further comprisingforming the structure with the aid of a hard mask.
 10. The method ofclaim 1, further comprising: applying a charge storage layer near to thesubstrate after the application of the spacer layer and prior to theapplication of the control electrode layer; patterning the chargestorage layer prior to the application of the control electrode layer.11. The method of claim 10, further comprising: planarizing the chargestorage layer; whole-area etching-back of the charge storage layer;forming at least one spacer element on the structure, patterning thecharge storage layer using the spacer element.
 12. A vertical fieldeffect transistor comprising a projection formed on a substrate forforming a channel region of a field effect transistor; a controlelectrode region of a control electrode of the field effect transistorformed on mutually opposite sides of the projection; an insulatingregion arranged between the control electrode regions and the projectionelectrically insulating and adjoining the channel region; a firstconnection region near the substrate at one end of the channel region;and a second connection region remote from the substrate at the otherend of the channel region, the control electrode having a planarinterface which lies parallel to a base area of the projection near thesubstrate.
 13. The field effect transistor of claim 12, wherein thecontrol electrode is delimited by the planar interface in at leastninety percent of its region in the direction of a normal (N) to thebase area, away from the substrate.
 14. The field effect transistor ofclaim 12, further comprising at least one charge storage region arrangedbetween an insulating region and a control electrode region.
 15. Thefield effect transistor of claim 14, which the charge storage region iscontained in a charge storage material having a further planar interfaceremote from the substrate, said further planar interface lying parallelto the base area of the projection.
 16. The field effect transistor ofclaim 15, wherein the charge storage material is delimited by thefurther planar interface remote from the substrate at least ninetypercent of its region in the direction of the normal (N) to the basearea, away from the substrate.
 17. The field effect transistor asclaimed in claim 12, wherein the control electrode encloses theprojection along a closed circulation, or in the charge storage materialencloses the projection along a closed circulation.
 18. The field effecttransistor as claimed in claim 12, wherein: the projection and thesubstrate are formed in monocrystalline fashion; the insulating regionis a region grown on the projection; the connection region near to thesubstrate is arranged with a lateral offset with respect to the basearea; or the projection has a minimal dimensioning of less than onehundred nanometers.